pb lead-free parts LSEG5292-PF ligitek electronics co.,ltd. property of ligitek only dual color led lamps data sheet doc. no : qw0905-LSEG5292-PF rev. : a date : 25 - jun. - 2007
gse 5.0 7.0 9.0 0.5 2.0 1.5 max 1 2 3 2.0min 2.54typ 1.anode green 2.common cathode 3.anode orange 2.0min 2.54typ 1 2 18.0min 3 0.5 typ 30 0 100 % 0 25 % 25 % 50 % 75 % 60 -30 75 % 100 % 50 % -60 page1/6 LSEG5292-PF part no. package dimensions directivity radiation note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. ligitek electronics co.,ltd. property of ligitek only
color lens material part no emitted 3.0 luminous intensity @10ma(mcd) typ. 45 spectral halfwidth nm 610 peak wave length pnm max. forward voltage @ ma(v) min. 1.8 min. viewing angle 2 1/2 (deg) 116 page ligitek electronics co.,ltd. property of ligitek only unit ma ma a mw 20 80 se ratings 10 ir -40 ~ +85 -40 ~ +100 80 forward current peak forward current duty 1/10@10khz parameter operating temperature storage temperature reverse current @5v power dissipation typical electrical & optical characteristics (ta=25 ) symbol t opr tstg i f pd i fp absolute maximum ratings at ta=25 note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. LSEG5292-PF 30 5653.06.0116 30 10 100 120 g green orange gap gaasp/gap 1.7 white diffused 2.6 1.7 2.6 20 2/6 LSEG5292-PF part no.
40 ligitek electronics co.,ltd. property of ligitek only fig.2 relative intensity vs. forward current forward current(ma) ambient temperature( ) fig.4 relative intensity vs. temperature 1.0 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 750 700 650 600 550 wavelength (nm) 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a 0.0 1.0 ambient temperature( ) fig.5 relative intensity vs. wavelength -20 0.8 -4020 0 0.9 80 60 40100 0.0 -40-20 020 0.5 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a f o r w a r d c u r r e n t ( m a ) forward voltage(v) fig.3 forward voltage vs. temperature 1.2 1.0 1.1 2.0 1.5 2.5 3.0 1.0 1.03.0 2.0 0.1 10 100 1.0 4.05.0 0.0 1.010 0.5 1.5 2.5 2.0 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve 1000 se chip 3.0 100 6080 1000 100 page 3/6 LSEG5292-PF part no.
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip 4/6 page LSEG5292-PF part no.
note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. page 5/6 2.wave soldering profile ligitek electronics co.,ltd. property of ligitek only soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) time(sec) 150 260 c3sec max 100 5 /sec max 50 preheat 2 /sec max 260 120 0 0 25 temp( c) 60 seconds max LSEG5292-PF part no.
ligitek electronics co.,ltd. property of ligitek only reference standard mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 description test condition test item reliability test: 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. low temperature storage test high temperature storage test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) operating life test this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. mil-std-202:103b jis c 7021: b-11 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. solder resistance test thermal shock test high temperature high humidity test 1.t.sol=230 5 2.dwell time=5 1sec solderability test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hours. this test intended to see soldering well performed or not. 6/6 page LSEG5292-PF part no.
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